晶圆激光背面打标设备

‌晶圆激光背面打标设备

具有激光功率自动补偿功能

可打标高翘曲产品，翘曲度≤10mm

具有上下相机图像融合功能，可以实时监测打标位置，具有打标自检功能

具有振镜自动校准，自动偏移补偿，铁环晶圆中心补偿功能

最小打标字高是0.1mm

Equipped with laser power automatic compensation function

Can be used for elevation warping products, with a warping degree of ≤ 10mm

Equipped with image fusion function for upper and lower cameras, capable of real-time monitoring of marking positions, and with marking self inspection function

Equipped with automatic scanner calibration , automatic offset compensation, and iron ring wafer center compensation functions

Minimum marking character height is 0.1mm

参数配置

功能描述

适用产品：8英寸、12英寸裸晶圆、带膜晶圆、6英寸带膜晶圆（可根据客户要求定制）

主要功能：实现晶圆芯片背面微小字符激光标记功能

进出料方式：Load port、Ring Frame

尺寸：L2770 * W1460 * H1900mm

Applicable products: 8-inch, 12-inch mirror wafers, coated wafers, and 6-inch coated wafers (customizable according to customer requirements)

Main function: To achieve laser marking of small characters on the back of wafer chips

Import and export method: Load port , Ring Frame

Size: L2770 * W1460 * H1900mm