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激光半导体

料条打标设备

2024-11-28 20:59 24 浏览

 料条打标设备‌


具有激光功率自动校正功能

可打标高翘曲产品,翘曲度≤4mm

具有振镜自动校正,料条方向检测,相机对位和打标自检功能

最小打标字符高度0.2mm

可打标不同厚度的料条

Equipped with laser power automatic calibration function

Can be used for elevation warping products, with a warping degree of ≤ 4mm

Equipped with automatic scanner calibration , strip direction detection, camera alignment, and self checking functions for marking


Minimum marking character height 0.2mm


Strip with different thickness can be marked


参数配置

功能描述

用产品:半导体料条

主要功能:实现料条正面激光标记功能

进出料方式:料盒 & 堆库

尺寸:L2550 * W1590 * H1850mm

Applicable products: Semiconductor strips

Main function: to achieve laser marking function on the front of the material strip


Import and export method: material box & stacking warehouse


Size: L2550 * W1590 * H1850mm

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