玻璃晶圆激光打孔设备

‌玻璃晶圆激光打孔设备

配备激光功率自动补偿功能

可用于玻璃晶圆打孔和玻璃切割

配备Bessel光学计（轴棱镜）,沿光束进行方向跟随长焦深（DOF）实现恒定峰值功率，范围通常为0.5~2.0mm

具有振镜自动校正功能和自动偏移补偿功能

一般光斑大小是2~3um

Equipped with laser power automatic compensation function

Can be used for glass wafer drilling and glass cutting

Equipped with Bessel optics(axicon) for constant peak power along an increased depth of focus(DOF)  region, ranging typically from 0.5~2.0mm

Equipped with automatic scanner calibration and automatic offset compensation

General spot size is about 2~3um

参数配置

功能描述

适用产品：8英寸、12英寸玻璃晶圆

主要功能：实现在玻璃激光打孔/切割

进出料方式：FOUP 到 FOUP

设备尺寸：L1500 * W2000 * H1800mm

Applicable products: 8-inch, 12 inch glass wafers

Main function: To achieve laser drilling / cutting on glass wafer

Import and export method: FOUP to FOUP

Size:L1500 * W2000 * H1800mm